TDM COMPACT加热翘曲度测试仪/Warpage Analysis-检测设备

产品详情

TDM–Compact加热翘曲测试仪/warpage analysis:

The TDM–Compact is a versatile instrument for a wide array of applications in the areas of process development, failure analysis, reliability, and quality control.

ABSOLUTE 3D CARTOGRAPHY

TDM is a patented tool for warpage analysis under a temperature profile. TDM uses the fringe projection technology (also called projection moiré) for non-contact, full-field acquisition of 3D topographies with a resolution as low as 0.5 μm. TDM-Compact acquires a full, absolute 3D cartography of devices with dimensions up to 310 mm x 230 mm (field of view up to 150 mm x 150 mm). Simultaneously, its powerful heating and cooling capabilities allow for virtually any temperature profile on the sample under test. The integrated software package provides tools for representation of the results as 3D plots, vectors diagrams, isometrics views and 2D profiles following user-defined profile lines (e.g., diagonal plots).

型号	TDM COMPACT

Imaging :	Direct sample illumination, non-contact measurement
Capabilities :	Topography analysis: z(x,y) function of the temperature
Maximum samples size :	310 mm x 230 mm
Oven size :	150 mm x 150 mm
Field of view (x,y) :	Continuous Zoom from 30 x 30 to 150 x 150 mm
Depth of view (z) :	Up to 25 mm
CCD camera resolution :	5 megapixel
Accuracy :	+/-1 micron or 2% of measured value, whichever is greater
(x,y) resolution :	15 μm to 75 μm depending on the FOV
Temperature range :	Room temperature to 300° C continuous
Heating method :	IR lamps - top and bottom
Heating rate :	Up to +3° C/s (sample dependent)
Cooling method :	Regulated flow of pulsed air
Cooling rate :	Up to -2° C/s above 120° C
Footprint :	140 cm x 120 cm x 245 cm
Weight approx :	330 kg
Utilities :	Electricity : 230 VAC, 50 Hz, single phase . Compressed air : 6 bar.